Product Information
  • Parts for semiconductor manufacturing
  • Device and system for semiconductor
  • Expendables for semiconductor manufacturing
  • Electronic rust prevention system

SEMICON Japan2010

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PAMPHLET

Parts for semiconductor manufacturing

LAPPING PLATE

LAPPING PLATE

The HIT Series lapping plates has been widely supplying for 20 years or more in both domestic and foreign countries such as Europe and Asia including the United States.
HMW provides the most suitable lapping plates, which are expected to support the next generation of IT industry. HMW provides any kind of lapping plates to satisfy users’ requirements.

HIT-SPREAD SERIES

1 GRADE HIT-SPREAD-1/2/3/4 per Hardness
2 GRAPHITE Super Fine Spheroidal Graphite
3 APPLICATION #1200~1500 / Abrasive Powder Size

HIT-SIEVE SERIES

1 GRADE HIT-SIEVE-1/2/3/4 per Hardness
2 GRAPHITE Fine Spheroidal Graphite
3 APPLICATION #1000~1200 / Abrasive Powder Size

HIT-STANDARD SERIES

1 GRADE HIT-45/70/90 per Hardness
2 GRAPHITE Standard Spheroidal Graphite
3 APPLICATION ~#1000 / Abrasive Powder Size

DRESSING GEAR

DRESSING GEAR

Dressing Gear is necessary for the maintenance of the flatness of lapping plate and conditioning on the surface. It is indispensable because it stabilizes the flatness of various wafers.
We will supply the most suitable dressing gear for our lapping plate.

HIT-STANDARD SERIES

1.Graphite shape Spheroidal graphite
2.Grade HIT-45(Hardness-wise) / Standard
HIT-60 / Semi-Hard
HIT-70 / Hard
HIT-90 / Super Hard

POLISHING CARRIER

POLISHING CARRIER

We will supply the lapping carrier for holding the work such as wafer when lapping. We are glad to receive the consultation from the selection of material (blue steel, stainless, aramid, POM and resin etc.) To the design, and produce the lapping carrier.

POLISHING PAD DRESSERS
Pad dressers with diamond grits are used for refining process of polishing pad. HMW provides superior thickness precision pad dressers by our high flatness technology.
POLISHING PLATE
HMW provides high precision polishing plates By high precision grinding technology and quality, HMW polishing plates are used for many fields, such as 300mm wafers, glass substrates , photo masks & etc.

Normal Carrier

1.Recommended application Silicon lapping
9B~32B / Size of lapping plate
2.Grade HIT-C1 / SK / Hv 300±30
HIT-C2 / SK-HD / Hv 390±30
HIT-C3 / SUS-HD / Hv 320±30
3.Thickness of the work 300~800μm

Insert Carrier

1.Recommended application Slicon polishing / lapping / Slicon polishing / Liquid crystal glass polishing
9B~32B / Size of lapping plate
2.Grade HIT-C1 / SK / Hv 300±30
HIT-C2 / SK-HD / Hv 390±30
HIT-C3 / SUS-HD / Hv 320±30
3.Insert material aramid/ EG / POM etc
4.Thickness of the work 450~800μm

Coating Carrier

1.Recommended application Slicon polishing
15B~32B / Size of lapping plate
2.Grade HIT-C2 / SK-HD / Hv 390±30
HIT-C3 / SUS-HD / Hv 320±30
3.Thickness of the work 650~1000μm

Double Carrier

1.Recommended application Glass disk polishing/Liquid crystal glass polishing
15B~42B / Size of lapping plate
2.Grade HIT-C1 / SK / Hv 300±30
HIT-C2 / SK-HD / Hv 390±30
HIT-C3 / SUS-HD / Hv 320±30
3.Insert material Aramid/ EG / POM etc
4.Thickness of the work 450~800μm
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