The HIT Series lapping plates has been widely supplying for 20 years or more in both domestic and foreign countries such as Europe and Asia including the United States.
HMW provides the most suitable lapping plates, which are expected to support the next generation of IT industry. HMW provides any kind of lapping plates to satisfy users’ requirements.

1 GRADE	HIT-SPREAD-1/2/3/4 per Hardness
2 GRAPHITE	Super Fine Spheroidal Graphite
3 APPLICATION	#1200～1500 / Abrasive Powder Size

1 GRADE	HIT-SIEVE-1/2/3/4 per Hardness
2 GRAPHITE	Fine Spheroidal Graphite
3 APPLICATION	#1000～1200 / Abrasive Powder Size

1 GRADE	HIT-45/70/90 per Hardness
2 GRAPHITE	Standard Spheroidal Graphite
3 APPLICATION	～#1000 / Abrasive Powder Size

Dressing Gear is necessary for the maintenance of the flatness of lapping plate and conditioning on the surface. It is indispensable because it stabilizes the flatness of various wafers.
We will supply the most suitable dressing gear for our lapping plate.

1.Graphite shape	Spheroidal graphite
2.Grade	HIT-45（Hardness-wise) / Standard HIT-60 / Semi-Hard HIT-70 / Hard HIT-90 / Super Hard

We will supply the lapping carrier for holding the work such as wafer when lapping. We are glad to receive the consultation from the selection of material (blue steel, stainless, aramid, POM and resin etc.) To the design, and produce the lapping carrier.

POLISHING PAD DRESSERS

Pad dressers with diamond grits are used for refining process of polishing pad. HMW provides superior thickness precision pad dressers by our high flatness technology.

POLISHING PLATE

HMW provides high precision polishing plates By high precision grinding technology and quality, HMW polishing plates are used for many fields, such as 300mm wafers, glass substrates , photo masks & etc.

1.Recommended application	Silicon lapping 9B～32B / Size of lapping plate
2.Grade	HIT-C1 / SK / Hv 300±30 HIT-C2 / SK-HD / Hv 390±30 HIT-C3 / SUS-HD / Hv 320±30
3.Thickness of the work	300～800μm

1.Recommended application	Slicon polishing / lapping / Slicon polishing / Liquid crystal glass polishing 9B～32B / Size of lapping plate
2.Grade	HIT-C1 / SK / Hv 300±30 HIT-C2 / SK-HD / Hv 390±30 HIT-C3 / SUS-HD / Hv 320±30
3.Insert material	aramid/ EG / POM etc
4.Thickness of the work	450～800μm

1.Recommended application	Slicon polishing 15B～32B / Size of lapping plate
2.Grade	HIT-C2 / SK-HD / Hv 390±30 HIT-C3 / SUS-HD / Hv 320±30
3.Thickness of the work	650～1000μm

1.Recommended application	Glass disk polishing/Liquid crystal glass polishing 15B～42B / Size of lapping plate
2.Grade	HIT-C1 / SK / Hv 300±30 HIT-C2 / SK-HD / Hv 390±30 HIT-C3 / SUS-HD / Hv 320±30
3.Insert material	Aramid/ EG / POM etc
4.Thickness of the work	450～800μm